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7YRSShenzhen Lehehe Technology Co., Ltd.

Ikhtisar Perusahaan

Album Perusahaan

Informasi dasar

Kapasitas R & D

R & D Proses

REFLOW
Allow the solder on both sides of the component to melt and bond with the motherboard. The advantage of this process

Penelitian & Pengembangan

11 - 20 People